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Home > NEWS > OIF Experts to Provide Technology Updates on AI, CEI Trends at DesignCon 2024

OIF Experts to Provide Technology Updates on AI, CEI Trends at DesignCon 2024

2024-01-12    

Fremont, Calif. – January 10, 2024 – OIF experts will provide valuable insights into the latest trends and developments in power consumption in optical AI networking and 224 Gbps Common Electrical I/O (CEI) at DesignCon 2024, taking place from January 30 to February 1, 2024, in Santa Clara, California.

 

DesignCon is the premier event for chip, board and systems design engineers in the high-speed communications and semiconductor industries. This year, OIF will lead two panel discussions:

 

Panel 1 - Wednesday, January 31, 2024: 12:15pm - 1pm PT

Reining in Power Consumption Trends for Next Generation Optical Networking - this panel will focus on strategies to address the ever-increasing power consumption challenges in the next generation of optical networking, featuring experts from leading companies in the field.

 

Moderator: Jeff Hutchins, Physical and Link Layer (PLL) Working Group (WG) Energy Efficient Interfaces (EEI) Vice Chair and Board Member, Ranovus

Panelists: Karl Bois, OIF Technical Committee Chair, NVIDIA; Yi Tang, OIF PLL WG Electrical Vice Chair, Cisco; and Nathan Tracy, OIF President, TE Connectivity

 

Panel 2 - Wednesday, January 31, 2024: 4pm - 5:15pm PT

OIF Update on 224 Gbps CEI Development - in this session, OIF will provide updates on the development of 224 Gbps CEI with insights from industry leaders involved in this cutting-edge technology.

 

Moderator: Nathan Tracy, OIF President, TE Connectivity

Panelists: John Calvin, Keysight Technologies; Mike Klempa, OIF PLL Interoperability WG Chair, Alphawave Semi; Mike Li, OIF Board Member, Intel and Cathy Liu, OIF Vice President, Broadcom Inc.

 

“Our participation at DesignCon 2024 underscores OIF’s commitment to driving technological innovation,” said Tracy. “These panel discussions offer a unique opportunity to learn from some of the industry’s foremost thought leaders and gain critical insights into OIF’s work. DesignCon provides a platform for connecting with colleagues, sharing insights and collectively shaping the future of optical networking and CEI. It’s where collaboration meets innovation.”

 

CMIS Technical Webinar Series: Separate from DesignCon, OIF is also hosting a series of free, public CMIS tutorial webinars. These webinars aim to equip engineers, developers and industry professionals with a comprehensive understanding of CMIS. The next session in the series – Data Path State Machine (DPSM) and Application Advertising – will be held on Wednesday, February 7, 2024. Presenters are Doug Cattarusa, Technical Marketing Engineer, Cisco and Paul Brooks, Applications and Technology, VIAVI Solutions. More information on the series can be found here.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.