Düsseldorf Germany – September 19, 2016 – Ranovus Inc., a leading provider of multi-terabit interconnect solutions for data center interconnect and communication networks, today announced the demonstration of a joint 4.8Tb/s DWDM Direct Detect solution operating over a single 80km fiber link for Data Center Interconnect (DCI) applications. The solution is designed to enable robust and cost-effective end-to-end scalable bandwidth connectivity for the DWDM metro network and cloud infrastructure markets.
In the last few years DCI has become a vital part of the DWDM metro network. A majority of the 80km links today is based on 10G DWDM solutions for which a migration to coherent solutions to increase bandwidth may not be a viable option due to cost and power consumption constraints. Furthermore, Internet Content Providers (ICPs), Data Center Operators (DCOs) and Cloud Service Providers (CSPs) are looking for a cost effective and power efficient solution to address their growing DCI requirements for various link distances, ranging from 15 km to 40 km, 80 km and beyond.
Leveraging key foundational technologies from Ranovus and Broadcom including a Quantum Dot Laser (QDL), Silicon Photonics (SiP) and low-power, high-performance BCM82251 56G PAM4 PHY IC, the Direct Detect solution delivers the lowest power per Gbit/s for DCI applications.
“We are excited to have collaborated with Broadcom in offering a disruptive Direct Detect solution for next generation DCI transport networks. We have been leading the development of innovative product solutions for the data center interconnect market utilizing our core QDL and SiP platform technologies. The combination of our technology along with a leading PAM4 platform offers a higher spectrally efficient solution to enable a DCI offering that is flexible, scalable, having the lowest cost and power per Gbit/s than any available offering in the market today” said Saeid Aramideh, Co-founder and Chief Marketing & Sales Officer at Ranovus. “Our solution set enables on-board optics as well as module-based solutions for pluggability into various Switch, Routing and DWDM Network Elements”.
As the data center interconnects transition to 100GbE and beyond, having an industry leading 56Gb/s PAM-4 PHY IC with high performance PAM-4 codec and FEC capability is critical to supporting a variety of 40G, 2x50G, 4x50G and 8x50G applications for next generation on-board optics and transceivers to meet the increased demand for higher bandwidth. Broadcom’s industry-leading PAM-4 technology provides a complete optical PAM-4 platform to accelerate the development of 40/100/200/400GbE solutions for inter/intra Data Center networks. Broadcom’s BCM82251 utilizes 20nm CMOS to deliver the industry’s lowest power and highest performance 2x50G PAM4 PHY.
Key Features of Ranovus’ Direct Detect based solution:
Ø Scalable optical engine with a variety of pluggable module form factors supporting switching, routing and DWDM platforms
Ø Supporting DCI and metro access distances for 15km, 40km, 80km+ applications
Ø Offering 96 DWDM channels in the C-band and L-band in the future
Ø 56Gb/s PAM4 PHY with multiple programmable FEC options to optimize link power and performance
Ø Full diagnostics and self-monitoring capabilities to enable high-reliability networks
Ø Enabling various Chirp and Output Power Management features
Ranovus will be showcasing the 200Gbps PAM4 solution for 80km+ DCI applications at ECOC 2016 (Stand #672) in Dusseldorf Germany, September 19-21, 2016. Contact Ranovus for additional information.
About Ranovus
Ranovus, with operations in Ottawa, Canada, Nuremberg, Germany and Mountain View, USA, develops and manufactures advanced solutions for the next generation of interconnects for the telecommunications and information technology industries. Our team has extensive experience in product development and commercialization of optoelectronics components and transceiver subsystems for the information technology industry. Ranovus’ current disruptive portfolio includes Quantum Dot Multi-Wavelength Laser technology and advanced digital and photonics integrated circuit technologies that are setting a new industry benchmark for the lowest power dissipation, size and cost for the next generation of optical interconnect solutions.
The company was founded in February 2012 and has received financing from leading venture capital firms including Azure Capital Partners, T-Venture, BDC Venture Capital, OMERS Ventures, MaRS Investment Accelerator Fund and Export Development Canada. Additional information about Ranovus can be found at www.ranovus.com
